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E-mail：sales@bestry-tech.com
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Address：Room 501, No.1996, Xinjinqiao Road, Pudong New district, Shanghai
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Spherical Alumina BAM & BAH series
Product Description：
Thermal conductivity of the material achieves heat conduction through the phonon, in which thermal fillers play an important role. In order to improve the thermally conductive efficiency of the thermal conduction channel through phonon, it is common to use mixed powder with different particle size to realize the gap filling between particles, so as to improve the thermal conductivity performance. Based on the above-mentionded and application requirements, the BAM series products were born in Bestry.
1. The mixing product of BAK series.
2. Higher filling ability.
3. More reasonable particle distribution.
4. Improve the efficiency of thermal conductivity.
BAH series
1. Applied in organic system, it will show a lower viscosity and higher filling capacity.
2. Surface substances applied in modification can promote the intercalation of fillers with polymer matrix, promoting thermal conductivity.
Critical Applications：
1.Thermal Interface Material: Filler for heat sink sheet, filler for heat dissipation board (MC board), heat dissipating grease, phase change sheet, semiconductor sealing resin, Silicone-based heatdissipating adhesive, and other compounds.
2.Thermal Engineering Plastics: LED lamp cover, switch shell, notebook shell, mobile phone shell, water tank, motor coil frame, etc.
3.High thermal conductivity aluminum-based CCL (Al Based CCL): high-power LED circuit board, power circuit board.
4. Alumina ceramic filter, artificial corundum, artificial sapphire raw material.
5. Thermal spray coating.
Shanghai Bestry Performance Materials Co., Ltd. All Rights Reserved 沪ICP备15015672号 Room 501, No.1996, Xinjinqiao Road, Pudong New district, Shanghai
Sales Department：021-50836933
E-mail：Sales@bestry-tech.com
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